• Abstract Submission Deadline

    July 31 (Wed.), 2024, August 31 (Sat.)
    September 13 (Fri.), 2024

  • Notification of Abstract Acceptance

    September 13 (Fri.), 2024
    October 11 (Fri.), 2024

  • Pre-Registration Deadline

    October 25 (Fri.), 2024
    November 1 (Fri), 2024

KISM NEWS

Final Program was announced to corresponding authors and presenters!

2024-10-30

Pre-registration Deadline has been extended by Nov. 1!

2024-10-28

Optional tour applications for foreigners are now available!

2024-10-22

Advance Program was announced to corresponding authors and presenters!

2024-10-21

Registration System is now open.

2024-09-27

The Online Abstract Submission Deadline has been extended by Sep. 13, 2024!

2024-09-02

The Online Abstract Submission Deadline has been extended by Aug. 31, 2024!

2024-07-31

The exhibition booth is closed early.

2024-07-01

The Online Abstract Submission is available Now!

2024-06-21

Sponsorship & Exhibition Guideline is updated!

2024-05-29

Our honorable plenary speakers are being updated!

2024-04-12

Our invited speakers are being updated!

2024-04-12

KISM 2024 BUSAN Official Website is now Open.

2024-03-22

PLENARY SPEAKERS

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The Evolution of Metrology & Inspection Technologies in Semiconductor; Past, Present, and Future Dr. Yusin Yang Samsung Electronics Co., Ltd., Korea
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Area-Selective Deposition for Advanced Semiconductor Devices Prof. Gregory Parsons North Carolina State Univ., USA
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Wide Bandgap Power Electronics: Challenges and a Path Forward Prof. Robert Nemanich Arizona State Univ., USA
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The Role and the Challenge of the Process Materials at Semiconductor Industry Dr. Deoksin Kil SK hynix, Korea
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New Mechanisms for Metal Thermal Atomic Layer Etching Prof. Steven George Univ. of Colorado, USA
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Recent Advancements in Cleans Technology to Reduce Particle Defectivity and Corrosion Dr. Paul Bernatis DuPont Electronics & Industrial, USA
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Atom Recombination on Surfaces in Plasmas- an Experimental Study Dr. Jean-Paul Booth CNRS/Ecole Polytechnique, France
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Next-Generation Semiconductor Manufacturing: Role of EUV Lithography and Advanced Process Development Dr. Halder Sandip imec, Belgium
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Surface Activated Bonding for 3D and Heterogeneous Integration: Current Status and Future Prospects Dr. Tadatomo Suga The Univ. of Tokyo, Japan
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Process Optimization and Control in Dry Etch Dr. Ye Feng Intel Corp., USA
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Silicon Carbide MOSFETs for Efficient EV Drivetrains and Renewable Energy Conversion Dr. Scott Allen ON Semiconductor, USA
KISM 2024 BUSAN LOGO Call for Abstract
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