Plenary Speakers

  • The Evolution of Metrology & Inspection Technologies in Semiconductor; Past, Present, and Future

    Dr. Yusin Yang

    Samsung Electronics Co., Ltd., Korea

  • Area-Selective Deposition for Advanced Semiconductor Devices

    Prof. Gregory Parsons

    North Carolina State Univ., USA

  • Wide Bandgap Power Electronics: Challenges and a Path Forward

    Prof. Robert Nemanich

    Arizona State Univ., USA

  • The Role and the Challenge of the Process Materials at Semiconductor Industry

    Dr. Deoksin Kil

    SK hynix, Korea

1. Nano Thin Film Deposition
  • New Mechanisms for Metal Thermal Atomic Layer Etching

    Prof. Steven George

    Univ. of Colorado, USA

2. CMP & Cleaning
  • Recent Advancements in Cleans Technology to Reduce Particle Defectivity and Corrosion

    Dr. Paul Bernatis

    DuPont Electronics & Industrial, USA

3. Advanced Etching Technology
  • Atom Recombination on Surfaces in Plasmas- an Experimental Study

    Dr. Jean-Paul Booth

    CNRS/Ecole Polytechnique, France

4. Advanced Lithography + Patterning
  • Next-Generation Semiconductor Manufacturing: Role of EUV Lithography and Advanced Process Development

    Dr. Halder Sandip

    imec, Belgium

5. Post Fabrication Technology and System Packaging
  • Surface Activated Bonding for 3D and Heterogeneous Integration: Current Status and Future Prospects

    Dr. Tadatomo Suga

    The Univ. of Tokyo, Japan

6. Frontier Metrology, Diagnosis, and Modeling for Nanoscale IC Integration and Emerging Device Process
  • Process Optimization and Control in Dry Etch

    Dr. Ye Feng

    Intel Corp., USA

7. Power Device
  • Silicon Carbide MOSFETs for Efficient EV Drivetrains and Renewable Energy Conversion

    Dr. Scott Allen

    ON Semiconductor, USA