Plenary Speakers
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The Evolution of Metrology & Inspection Technologies in Semiconductor; Past, Present, and Future
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Area-Selective Deposition for Advanced Semiconductor Devices
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Wide Bandgap Power Electronics: Challenges and a Path Forward
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The Role and the Challenge of the Base Material for the Future of Semiconductor Memory Biz
1. Nano Thin Film Deposition
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New Mechanisms for Metal Thermal Atomic Layer Etching
2. CMP & Cleaning
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Recent Advancements in Cleans Technology to Reduce Particle Defectivity and Corrosion
3. Advanced Etching Technology
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Atom Recombination on Surfaces in Plasmas- an Experimental Study
5. Post Fabrication Technology and System Packaging
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Surface Activated Bonding for 3D and Heterogeneous Integration: Current Status and Future Prospects
6. Frontier Metrology, Diagnosis, and Modeling for Nanoscale IC Integration and Emerging Device Process
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Process Optimization and Control in Dry Etch
7. Power Device
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Silicon Carbide MOSFETs for Efficient EV Drivetrains and Renewable Energy Conversion