Plenary Speakers

  • The Evolution of Metrology & Inspection Technologies in Semiconductor; Past, Present, and Future

    Dr. Yusin Yang

    Samsung Electronics Co., Ltd., Korea

    Biography

  • Area-Selective Deposition for Advanced Semiconductor Devices

    Prof. Gregory Parsons

    North Carolina State Univ.

    Biography

  • Wide Bandgap Power Electronics: Challenges and a Path Forward

    Prof. Robert Nemanich

    Arizona State Univ., USA

    Biography

  • The Role and the Challenge of the Base Material for the Future of Semiconductor Memory Biz

    Dr. Deoksin Kil

    SK hynix, Korea

    Biography
1. Nano Thin Film Deposition

  • New Mechanisms for Metal Thermal Atomic Layer Etching

    Prof. Steven George

    Univ. of Colorado, USA

    Biography
2. CMP & Cleaning

  • Recent Advancements in Cleans Technology to Reduce Particle Defectivity and Corrosion

    Dr. Paul Bernatis

    DuPont Electronics & Industrial, USA

    Biography
3. Advanced Etching Technology

  • Atom Recombination on Surfaces in Plasmas- an Experimental Study

    Dr. Jean-Paul Booth

    CNRS/Ecole Polytechnique, France

    Biography
5. Post Fabrication Technology and System Packaging

  • Surface Activated Bonding for 3D and Heterogeneous Integration: Current Status and Future Prospects

    Dr. Tadatomo Suga

    The Univ. of Tokyo, Japan

    Biography
6. Frontier Metrology, Diagnosis, and Modeling for Nanoscale IC Integration and Emerging Device Process

  • Process Optimization and Control in Dry Etch

    Dr. Ye Feng

    Intel Corp., USA

    Biography
7. Power Device

  • Silicon Carbide MOSFETs for Efficient EV Drivetrains and Renewable Energy Conversion

    Dr. Scott Allen

    ON Semiconductor, USA

    Biography
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