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Invited Speakers
1. Nano Thin Film Deposition
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Nano Thin Film Technologies for Charge Trap Flash in VNAND
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Application of Thin Film Process in Memory Devices
Dr. Inhee Lee
SK hynix, Korea
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Surface Reaction Mechanisms of SiN ALD Analyzed with Atomic-Scale Simulations
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Recent Advances in Mo-Based Electrode Materials for High-Performance DRAM Cell Capacitors
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Advanced ALD Process for Meta-Stable Phased Thin Film Deposition
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Precursor Chemistry in Semiconductor Industry
Dr. Jin-Sik Kim
UP Chemical Co., Ltd., Korea
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Atomic Layer Deposition Process and Its Application for Semiconductor Field
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Recent Studies on Atomic Layer Deposition of High-k Dielectric Thin Films for Capacitor Applications
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Atomic Layer Etching for Area Selective Deposition: Growth Inhibition of ZnS ALD on Etched Substrates
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Recent development of Selective Atomic Layer Deposition for Electronic Devices
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Interfacial-Engineering-Enabled Low-Voltage (0.8V) Switching Ferroelectric Hf0.5Zr0.5O2 Capacitor for Low-Power Ferroelectric Random-Access-Memory
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Interfacial Engineering for Ferroelectric Memories with Improved Performance
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Computational Fluid Dynamics Analysis of the Canisters for the Mass Supply of Solid Precursors
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Enhancing ALD Growth Characteristics Through Surface Reaction Control
Dr. Changbong Yeon
Soulbrain Co., Ltd., Korea
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SMART Nanometallization for Power-Efficient and Reliable Edge
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Challenges and Innovations in ThinFilm Technology In the New Era of Paradigm Shift
2. CMP & Cleaning
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Paradigm Changes in Semicondcutor Cleaning
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Planarization for Advanced Semiconductor Processing: Challenges and Opportunities
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The Effects of Wet Seria Abrasives on CMP Performances
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TBA
Prof. Ho Jun Kim
Hanyang Univ., Korea
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Surface-Structured Pads for Scratch-Less Chemical Mechanical Polishing
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Corrosion Prevention and Prediction Strategies in Emerging Metal CMP
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Study on Bubbles in Wafer Clean System
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Effect of ceria surface orientation on SiO2 CMP
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Monitoring of Slurry Components and Concentration for CMP Process via Raman Spectroscopy
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Eco-Innovations in Semiconductor Manufacturing: Sustainable CMP Approaches for the Next Generation
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The Mechanical Aspects of Chemical Mechanical Planarization (CMP): its known, unknown, and challenges in industry.
3. Advanced Etching Technology
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TBA
Dr. Chanmin Lee
Samsung Electronics Co., Ltd., Korea
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Recent Trend and Challenge of Advanced Dry Etching Technology
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TBA
Mr. Hoon Hee Cho
Lam Research Korea, Korea
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Controlling Lateral Modification on Plasma Oxidation Using Optimizing Plasma Conditions during Isotropic Atomic Layer Etching
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The Next Generation of Complementary FET (CFET) Etch Challenges and Progress
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Advances in Pulsed RF Power Delivery for Plasma Processes
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Engineering Semiconducting and Dielectric Materials and Processes Using Integrative Methods
4. Advanced Lithography
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The Challenges of EUVL Patterning and Discussion about the Technology to Prepare for Next Generation Devices
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High NA EUV Lithography: Prospects and Challenges
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High NA EUV – What does it change for Design, OPC and Mask?
5. Post Fabrication Technology and System Packaging
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TBA
Dr. Minwoo Rhee
Samsung Electronics Co., Ltd., Korea
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Technology Trends of Memory Package for High Bandwidth in AI Era
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TBA
Dr. Kwang-Seong Choi
ETRI, Korea
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TBA
Dr. Seungwoo Choi
TEL, Korea
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Wafer Bonding for Chiplet and Logic Devices
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AFM in Advanced Packaging & Hybrid Bonding
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TBA
Dr. Seak-Joon Lee
ITI, Korea
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TBA
Dr. Wei-Chung Lo
Industrial Tech. Research Inst., Taiwan
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3D & Heterogeneous Integration at CEA-Leti
6. Frontier Metrology, Diagnosis, and Modeling for Nanoscale IC Integration and Emerging Device Process
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Data Intelligence for Semiconductor Autonomous Fab
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Next Generation Metrologies in Support of Emerging Materials and Devices
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Bridging the Gap: From Surface Topography to Semiconductor Applications with ISE and AFM
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Multiscale Simulation and AI-Driven Approaches for Comprehensive Understanding of Advanced Materials and Semiconductor Processing
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Advancements in Metrology for Materials and Device Characterization: Exploring Innovative In-Materials Processing Techniques for Emerging Applications
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Optical Metrology Development Trends in Today's Advanced Device Nodes
7. Power Device
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RISE WBG (Wide Bandgap) System Integration - Activities and Facilities
8. Carbon Neutrality in Semiconductor Industry
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Research on Carbon Neutrality Efforts and Product Life Cycle Assessment (LCA) in the Semiconductor Industry
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Cryogenic Plasma Etching for Semiconductor Processes Towards Carbon Neutrality
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Process Intensified Carbon Capture Solution for Semiconductor Industry: Rotating Packed-Bed
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Green Aluminum Metal-Organic Frameworks (Al-MOFs) Assisted Commercial Activated Carbon for Enhanced Fluoride Removal from Semi-Conductor Industrial Effluents
