Program at a Glance

KST	EEST Athens	CEST (CET) Paris	UTC	EDT New York	PDT Los Angeles

Last update : October 17, 2024 (KST)

Nov. 11 (Mon.)	Time	Paradise Hotel Busan
		Room A (Capri Room, 2F)	Room D (Sidney Room, 2F)
	14:00-17:00	Tutorial 1 (in Korean Language) Technology Trend of Advanced package for AI semiconductor Dr. Minsuk Suh (Camtek Korea, Korea)	Tutorial 2 (in Korean Language) Development Trend and Prospect of NAND Memory Device and Process Integration Prof. Changhan Kim (Hanyang Univ., Korea)
	17:00-17:15	Break
	17:15-18:15	Short Course (in Korean Language) The Principle and Device Structure of DRAM Prof. In-Ho Nam (Hanyang Univ., Korea)
	18:15-18:30	Break
	18:30-20:00	Welcome Reception (Sicily Room, 1F, Paradise Hotel Busan)

Nov. 12 (Tue.)	Time	Paradise Hotel Busan					Grand Josun Busan		2F Lobby in Paradise Hotel Busan & 5F Lobby in Grand Josun Hotel Busan
		Room A (Capri Room, 2F)	Room B (Grand Ballroom 1, 2F)	Room C (Grand Ballroom 3, 2F)	Room D (Sidney Room, 2F)	Room E (Sicily Room, 1F)	Room F (Ballroom, 5F)	Room G (Meeting Room, 5F)
	10:00-10:45	Plenary Session I (Capri Room, 2F in Paradise Hotel Busan) The Evolution of Metrology & Inspection Technologies in Semiconductor; Past, Present, and Future Dr. Yusin Yang (Samsung Electronics Co., Ltd., Korea)							Exhibition
	10:45-11:00	Coffee Break
	11:00-11:30	Opening Ceremony (Grand Ballroom 1, 2, 3, 2F, Paradise Hotel Busan)
	11:30-13:00	Lunch
	13:00-14:40	TuA1 (CMP)	TuB1 (Power)		TuD1 (Litho)	TuE1 (Etching)	TuF1 (Thin Film)	TuG1 (MI)
		Advanced Ceria Abrasive Based CMP	Power Device I		Advanced Lithography I	Plasma Surface Interaction	Nano Thin Film Deposition I	Frontier Metrology and Modeling I
	14:40-14:55	Coffee Break
	14:55-16:35	TuA2 (CMP)	TuB2 (Power)		TuD2 (Litho)	TuE2 (Etching)	TuF2 (Thin Film)	TuG2 (MI)
		Challenges and Opportunities in CMP	Power Device II		Advanced Lithography II	Advanced Device and Processes	Nano Thin Film Deposition II	Frontier Metrology and Modeling II
	16:35-16:50	Break
	16:50-17:40	Poster Session I

Nov. 13 (Wed.)	Time	strong>Paradise Hotel Busan					Grand Josun Busan		2F Lobby in Paradise Hotel Busan & 5F Lobby in Grand Josun Hotel Busan
		Room A (Capri Room, 2F)	Room B (Grand Ballroom 1, 2F)	Room C (Grand Ballroom 3, 2F)	Room D (Sidney Room, 2F)	Room E (Sicily Room, 1F)	Room F (Ballroom, 5F)	Room G (Meeting Room, 5F)
	09:00-10:40	WeA1 (CMP)	WeB1 (Power)	WeC1 (PKG)	WeD1 (Litho)	WeE1 (Etching)	WeF1 (Thin Film)	WeG1 (MI)	Exhibition
		CMP Innovations	Power Device III	Advanced Bonding Technology	Lithography Process I	Advanced Etching I	Nano Thin Film Deposition III	Frontier Metrology and Modeling III
	10:40-10:55	Coffee Break
	10:55-11:40	Plenary Session II (Capri Room, 2F, Paradise Hotel Busan) Area-Selective Deposition for Advanced Semiconductor Devices Prof. Gregory Parsons (North Carolina State Univ., USA)
	11:40-13:10	Lunch
	13:10-13:55	Plenary Session III (Capri Room, 2F, Paradise Hotel Busan) Wide Bandgap Power Electronics: Challenges and a Path Forward Prof. Robert Nemanich (Arizona State Univ., USA)
	13:55-14:10	Coffee Break
	14:10-15:50	WeA2 (CMP)	WeB2 (ESG)	WeC2 (PKG)	WeD2 (Litho)	WeE2 (Etching)	WeF2 (Thin Film)	WeG2 (MI)
		Advanced Cu and Mo CMP	Carbon Neutrality in Semiconductor Industry I	Hybrid Bonding & Evaluations	Lithography Process II	Advanced Etching II	Nano Thin Film Deposition IV	Frontier Metrology and Modeling IV
	15:50-16:05	Break
	16:05-17:45	WeA3 (CMP)				WeE3 (Etching)	WeF3 (Thin Film)	WeG3 (MI)
		Advanced Cleaning Technology				Plasma Source Technology	Nano Thin Film Deposition V	Frontier Metrology and Modeling V
	17:45-18:30	Break
	18:30-20:30	Banquet (Grand Ballroom, 2F, Paradise Hotel Busan)

Nov. 14 (Thu.)	Time	Paradise Hotel Busan					Grand Josun Busan		2F Lobby in Paradise Hotel Busan & 5F Lobby in Grand Josun Hotel Busan
		Room A (Capri Room, 2F)	Room B (Grand Ballroom 1, 2F)	Room C (Grand Ballroom 3, 2F)	Room D (Sidney Room, 2F)	Room E (Sicily Room, 1F)	Room F (Ballroom, 5F)	Room G (Meeting Room, 5F)
	09:00-10:40	ThA1 (CMP)	ThB1 (ESG)	ThC1 (PKG)	ThD1 (Litho)	ThE1 (Etching)	ThF1 (Thin Film)	ThG1 (MI)	Exhibition
		Functional Wet Etching Technology	Carbon Neutrality in Semiconductor Industry II	Heterogeneous Intergratoin	Alternative Lithography I	Advanced Etching and Monitoring	Nano Thin Film Deposition VI	Frontier Metrology and Modeling VI
	10:40-10:50	Coffee Break
	10:50-12:30	ThA2 (CMP)	ThB2 (ESG)	ThC2 (PKG)	ThD2 (Litho)	ThE2 (Etching)	ThF2 (Thin Film)
		Cleaning Challenges for the Next Generation Devices	Carbon Neutrality in Semiconductor Industry III	Process and Intergration	Alternative Lithography II	Modeling Etch Processes	Nano Thin Film Deposition VII
	12:30-14:00	Lunch
	14:00-14:45	Special Session I (Capri Room, 2F, Paradise Hotel Busan) Basics of Space Radiation Effects on Microelectronics Dr. Insoo Jun (NASA JPL, USA)
	14:45-15:30	Special Session II (Capri Room, 2F, Paradise Hotel Busan) Memory Technology 2024 and Outlook: DRAM, NAND, Emerging Memory Dr. Jeongdong Choe (TechInsights, Canada)
	15:30-15:40	Break
	15:40-16:25	Plenary Session IV (Capri Room, 2F, Paradise Hotel Busan) The Role and the Challenge of the Base Material for the Future of Semiconductor Memory Biz Dr. Deoksin Kil (SK hynix, Korea)
	16:25-16:35	Coffee Break
	16:35-17:25	Poster Session II
	17:25-17:40	Break
	17:40-18:10	Closing Ceremony & Award Ceremony (Capri Room, 2F, Paradise Hotel Busan)

Nov. 15 (Fri.)	Time	Paradise Hotel Busan					Grand Josun Busan		2F Lobby in Paradise Hotel Busan & 5F Lobby in Grand Josun Hotel Busan
		Room A (Capri Room, 2F)	Room B (Grand Ballroom 1, 2F)	Room C (Grand Ballroom 3, 2F)	Room D (Sidney Room, 2F)	Room E (Sicily Room, 1F)	Room F (Ballroom, 5F)	Room G (Meeting Room, 5F)
	(Half) 08:30-12:00 (Full) 08:30-17:30	Optional Tour

Topic	Sessions
1. Nano Thin Film Deposition	TuF1, TuF2, WeF1, WeF2, WeF3, ThF1, ThF2
2. CMP & Cleaning	TuA1, TuA2, WeA1, WeA2, WeA3, ThA1, ThA2
3. Advanced Etching Technology	TuE1, TuE2, WeE1, WeE2, WeE3, ThE1, ThE2
4. Advanced Lithography + Patterning	TuD1, TuD2, WeD1, WeD2, ThD1, ThD2
5. Post Fabrication Technology and System Packaging	WeC1, WeC2, ThC1, ThC2
6. Frontier Metrology, Diagnosis, and Modeling for Nanoscale IC Integration and Emerging Device Process	TuG1, TuG2, WeG1, WeG2, WeG3, ThG1, ThG2
7. Power Device	TuB1, TuB2, WeB1
8. Carbon Neutrality in Semiconductor Industry	WeB2, ThB1, ThB2